3D IC Design Services
Syntronix leverages cutting-edge 3D Wafer-on-Wafer (WoW) technology to integrate Logic IPs and DRAM into a single chip. This 3D architecture significantly shortens data paths and minimizes latency, driving a leapfrog advancement in system performance.
By integrating our proprietary high-bandwidth DRAM controller IP, we accelerate access speeds while achieving a breakthrough in reducing power consumption. This highly integrated design simplifies system architecture, enhances component density, and optimizes production efficiency.
Transcending 2D physical limits, our technology supports 40nm, 28nm, and 12nm nodes. Specifically engineered for AI computing, Edge IoT, and HPC, it delivers high performance and ultra-low power consumption. Syntronix achieves the optimal balance of efficiency and sustainability, empowering customers to accelerate innovation and secure a decisive market advantage.